Solderless breadboards, 830 and 400 tie points
Solderless breadboards, 830 and 400 tie points
Solderless breadboards, 830 and 400 tie points
  1. Solderless breadboards, 830 and 400 tie points
  2. Solderless breadboards, 830 and 400 tie points
  3. Solderless breadboards, 830 and 400 tie points

Solderless Breadboard, 830 or 400 Points (3-Pack)

From $6.99

Solderless prototyping breadboards with 2.54 mm (0.1 in) pitch, sold in packs of three: full-size 830-point (MB-102) or half-size 400-point. Self-adhesive back; boards snap together.

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SKU: KYM-DT-BB Category:

Standard solderless breadboards for building and testing circuits without soldering. Each board has two power rails on each side and a centre channel sized for DIP packages.

Specifications

  • Pitch: 2.54 mm (0.1 in)
  • Tie points: 830 (MB-102, about 165 × 55 mm) or 400 (about 83 × 55 mm)
  • Wire size: 20–29 AWG solid wire and standard Dupont jumper pins
  • Back: Self-adhesive foam; side dovetails join boards together
  • Pack: 3 boards of the selected size

Typical uses

  • Prototyping ESP32, Arduino-compatible and Raspberry Pi circuits
  • Sensor, display, and relay module tests before a PCB
  • Classroom and workshop kits

Ordering notes

  • Ships within 5 business days after payment.
  • Shipping: USD 15 per order worldwide, free from a USD 79 merchandise subtotal. See Shipping.
  • Need a larger quantity, a different version, or a custom carrier board? Request a quote.
Pack

830-point × 3, 400-point × 3

Related products

Kymopsis — RF & mmWave components, radar kits, and engineering services.
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